Kurt Sievers has served as president and chief executive officer of NXP since May 2020.
As a member of NXP’s executive management team since 2009, Kurt has been instrumental in leading the definition and implementation of NXP’s strategy for “secure connections for a smarter world.” Prior to being elected CEO, Kurt served as president of NXP and oversaw all of the company’s business lines. In 2019, Kurt led the successful acquisition of Marvell’s Wi-Fi Connectivity Business Unit, enabling NXP to deliver complete, scalable processing and connectivity solutions to customers across NXP’s focus end markets. In 2015, he played a key role in the merger of NXP and Freescale Semiconductor, which created one of the world’s leading semiconductor companies and a leader in automotive semiconductors and secure edge processing.
Kurt joined NXP in 1995, progressing through a series of sales and marketing, product definition and development, strategy and general management leadership positions across a broad number of market segments.
Kurt earned a Master of Science degree in physics and computer science from Augsburg University, Germany.
Henri Ardevol is executive vice president and general manager of Automotive Processing at NXP Semiconductors. In this role, he is responsible for leading the premier portfolio of microcontrollers and processors for the automotive industry.
Henri has more than 25 years of experience in the semiconductors industry. Prior to being appointed to his current role in 2018, he served as NXP’s head of corporate strategy with a major impact on the company’s direction and a primary role in shaping and executing transformational moves such as the NXP-Freescale merger.
Henri started his career with NXP in sales where he held different leadership positions across Europe, the United States and Asia. As a general manager for embedded secure solutions, he then led the creation of the NFC ecosystem and mobile transactions business as well as the global expansion of the company’s contactless smartcard business to reach true leadership in secure transactions.
Henri studied telecommunications engineering at the Barcelona Polytechnic University as well as a PMD at IESE.
Bill Betz is executive vice president and chief financial officer at NXP Semiconductors. In this role, he is responsible for all aspects of the company’s financial and accounting functions including treasury, investor relations, audit, tax and mergers and acquisitions.
Bill has more than 20 years of finance experience in the semiconductor industry with a strong track record focused on results. He has held several financial leadership positions with Fairchild Semiconductors, LSI Logic and Agere Systems.
Prior to being named CFO, Bill was senior vice president, business planning & analytics and finance business group controller for NXP’s business lines and shared service centers, and led the corporate financial planning, analysis and business intelligence teams.
Bill holds a Master of Business Administration from the University of Chicago Booth School of Business, and a Bachelor of Science in Business Administration from West Virginia University.
Paul Hart is executive vice president and general manager of Radio Power for NXP Semiconductors. In this role, Paul is responsible for maximizing NXP’s leadership position in 5G and identifying new market opportunities to drive growth with best-in-class technologies, product offerings and system solutions spanning the entire range of 5G frequencies and power.
Paul joined Motorola Semiconductor as a radio frequency (RF) engineer in 2001, transferring to Freescale in 2006 and to NXP in 2015. He has more than 19 years of semiconductor industry experience specializing in the development, launch and life cycle management of cutting-edge RF solutions.
Prior to his current role, Paul managed the radio frequency business at NXP. Before that, he led NXP’s RF applications engineering teams and the engineering efforts that sharpened the company’s focus on next-generation power amplifier (PA) architectures, radio algorithms and radio system integration and RF PA customer reference designs. He also has been responsible for the development and new product introduction of the digital front-end product family.
Paul earned a Bachelor of Science in electrical engineering from the University of Arizona and a Master of Science in microwaves and optoelectronics from University College London.
Jens Hinrichsen is executive vice president and general manager of Advanced Analog for NXP Semiconductors. In this role, Jens is responsible for providing leading analog product solutions including secure interfaces, power management, charging and power supplies, sensors, car access and battery management.
Advanced analog product solutions support all industry verticals leveraging world-class technology and benchmark application expertise for automotive, mobile, computing, industrial and IoT.
Jens has 25 years of experience in the semiconductor industry, starting his career in 1995 at Philips Semiconductors in Germany. Having held several positions within Philips in Europe and Asia, such as supply chain management, assembly operations and international product marketing, he took over the responsibility as general manager for the small signal diodes business in 2003. From 2005 onwards, Jens spent nine years in San Jose, CA, as general manager for NXP Semiconductors logic products and later the interface products business. After returning to Europe in late 2013, he took over the automotive analog business line. By 2015, under his leadership, this line integrated all Freescale automotive analog business activities. In January 2020 his business line was merged with all remaining NXP sensor and analog solutions to create BL Advanced Analog.
Jens holds a degree in mechanical engineering and business from the Technical University in Berlin.
Torsten Lehmann is executive vice president and general manager of Radio Frequency Processing for NXP Semiconductors.
Torsten has a proven track record in the automotive electronics space, with experience across multiple market segments during his more than twenty years career in the industry. He has held various product management, marketing, sales, strategy and business leadership functions within Philips Components, Philips Semiconductors and since 2006 within NXP Semiconductors.
Since 2010, Torsten has been the Business Line General Manager with full profit and loss ownership. His responsibilities and scope have grown over the years, starting initially with a focus on infotainment, then extending the business into fast growth driver assistance applications with responsibility for the complete NXP radar business. Torsten also has responsibility for the personal health product line.
Torsten holds a master's degree (Dipl.-Ing.) in electrical engineering from the University of Technology (RWTH) in Aachen, Germany. He also holds an Executive MBA with distinction from INSEAD in Fontainebleau, France.
Ron Martino is executive vice president and general manager of Edge Processing for NXP Semiconductors. In this role, he is responsible for driving embedded compute leadership for edge processing in industrial, IoT and networking markets.
Ron is an established leader with over 30 years of experience in the microelectronics business focused on automotive electronics, embedded processing applications, high performance computing applications and semiconductor research and development.
Ron’s prior responsibilities include general manager of the i.MX application processors and advanced technology adoption in NXP’s former microcontrollers business. He achieved broad adoption and rapid growth of the i.MX application processor business across automotive and industrial applications. Ron was also the executive leader of NXP’s global microcontroller R&D organization, developing products for multiple applications across consumer, industrial and automotive segments. Responsibilities also included non-volatile memory process technology and IP module development. In addition, Ron was responsible for NXP’s joint development partnership with ST Microelectronics for automotive MCUs.
Ron joined Freescale (now NXP) in February 2008 from IBM, where he was Director of Power Architecture for MPU Business. He worked at IBM for 20 years focusing on high performance computing, networking, radio frequency (RF) communication, and gaming microelectronics. Ron also served as director of IBM’s ASIC and core IP development organization, manager of IBM’s RF product introduction organization and manager of an advanced technology support team.
Ron holds a Bachelor of Science degree in chemical engineering from Drexel University and a Master of Science in materials science from the University of Vermont.
Rafael Sotomayor is executive vice president and general manager of Connectivity and Security for NXP Semiconductors. In this role, he oversees the solutions that drive the security and connectivity ecosystems. These solutions include devices enabled with NFC, UHF, UWB, Bluetooth and Wi-Fi; and secure products for mobile payment, banking, secure ID, transit and secure services for IoT.
Prior to joining NXP in 2014, Rafael was as vice president of marketing at Broadcom in the wireless connectivity business and prior to that, he was at Motorola and Intel.
Rafael holds an MBA from Harvard Business School, an MSEE from Georgia Tech and BSEE from Purdue University.